Website under construction.
Website under construction.
Website under construction.
Website under construction.

RX-MODEL

Rhonexum introduces the RX-Model — a SPICE-compatible compact model built specifically for cryogenic circuit simulation.

While traditional models struggle at ultra-low temperatures, relying on bloated room-temperature frameworks with hundreds of parameters, the RX-Model sets a new standard: fast, stable, and cryo-native.
● A tiny chip like this can have massive costs and delay. in ourdays, a fabrication cycle can take up to $25k per mm2 in 8 months.

86%

of the designs fail on the first try.
That’s where we start.

fewer chips.
less cash.
faster results.

Existing Solutions
10 manufacturing runs
1 manufacturing run
80 months
8 months
$2M
$200K
90% Time & Cost reduction
Existing Solutions
10 manufacturing runs
80 months
$2M
1 manufacturing run
8 months
$200K
90% Time & Cost reduction

Let’s design a circuit together.

SET FUNCTIONALITIES
DERIVE REQUIREMENTS
[ START ITERATIONS ]
CHOOSE COMPONENTS
DESIGN CIRCUIT
BLIND DESIGN PROCESS
[ NO SIMULATION ]
RX-MODEL
[ SIMULATION ]
MANUFACTURING
TESTING
[ END ITERATIONS ]
LAUNCH CIRCUIT!
manufacturing runs
10
months
80
$
2M
with rx-model
manufacturing runs
1
months
8
$
200K
Engineered with a physics-based, semi-empirical approach and advanced normalization techniques, RX-Model delivers robust, numerically stable simulations across cryogenic regimes. It’s technology-agnostic, working seamlessly with various CMOS processes.

Unlike conventional tools, RX-Model captures key cryogenic effects — like quantum transport — without convergence issues. It uses significantly fewer parameters, is deployable in days, and plugs effortlessly into both commercial and open-source platforms.
simulation display example
PREVIEW AVAILABLE SOON

currently adapted for

Our experience with these technologies has been instrumental in the development of the libraries.
GF
22 nm FDSOI
ST
28 nm FDSOI
TSMC
28 nm Bulk
[ RX-MODEL ]
[ MANUFACTURING PROCESS ]
[ CHIP DESIGN ]
[ RX-MODEL ]
[ MANUFACTURING PROCESS ]
[ CHIP DESIGN ]